暖通空调>期刊目次>2025年>第7期

基于数据中心热管理的新型环路热管设计研究

Design study on a new type of loop heat pipe based on data center thermal management

熊康宁[1][2] 潘青松[1] 张文娟[3] 刘 洋[1] 曹庆峰[1] 崔 勇[1]
[1]西安建筑科技大学,西安;[2]绿色建筑全国重点实验室,西安;[3]西安稀有金属材料研究院有限公司,西安

摘要:

针对数据中心空调系统能耗占比较大的现状,提出了一种解决方案——采用新型结构设计的环路热管技术。环路热管作为一种被动、高效的两相传热器件,其性能的优化对于提升数据中心冷却效率、降低能耗具有重要意义。设计了一种新型蒸发器结构且冷凝管线并联的环路热管,研究结果表明:在750 W的输入功率下,当冷却水温度处于10~40 ℃范围内时,环路热管在30 ℃时的热源结点温度最低;当冷却水流量处于1~4 L/min范围内时,环路热管在流量为1 L/min时的热源结点温度最低。进一步研究发现,环路热管的稳态操作温度由冷凝器的冷却效率和吸液芯中工质补充速率共同决定。当冷却水温度为40 ℃时,环路热管热阻RLHP和系统总热阻Rsys均较低,而冷却水流量对RLHP和Rsys的影响不显著。本文提出的新型环路热管结构设计,通过强化传热性能和优化工质分配,将显著提升数据中心空调系统的冷却效率,为解决数据中心高能耗问题提供了一种技术方案。

关键词:数据中心;环路热管;传热性能;冷却水温度;冷却水流量;热阻

Abstract:

This study addresses the significant energy consumption of data center air conditioning systems by proposing an innovative loop heat pipe design. As a passive, highly efficient two-phase heat transfer device, the optimized loop heat pipe performance is crucial for improving cooling efficiency and reducing energy consumption. A new type of loop heat pipe with enhanced evaporator structure and parallel condenser lines is developed. Research results show that at 750 W input power, the heat source junction temperature reaches its minimum when the cooling water temperature is 30 ℃ within the 10-40 ℃ range. Similarly, the lowest junction temperature occurs at 1 L/min when the cooling water flow rate is within the 1-4 L/min range. Further study reveals that the steady-state operating temperature is determined by both condenser cooling efficiency and working fluid replenishment rate in the wick. When the cooling water temperature is 40 ℃, the loop heat pipe thermal resistance RLHPand the system thermal resistance Rsysare low, while the cooling water flow rate shows a negligible impact on RLHPand Rsys. The new type of loop heat pipe structure significantly enhances cooling efficiency through improved heat transfer performance and optimized fluid distribution, providing a technical solution for high energy consumption in data centers.

Keywords:data center; loop heat pipe; heat transfer performance; cooling water temperature; cooling water flow rate; thermal resistance

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