Research on server arrangement of liquid immersion cooling systems

Yan Xun, Yu Hang, Li Chaoen


The liquid immersion cooling system is a new cooling method for data centers, which can enhance heat transfer by soaking the server motherboard in the insulating heat exchange medium to boiling. In this paper, the fluid temperature and velocity fields under different arrangements and spacing of the server motherboards in the liquid immersion cooling system are simulated by ANSYS software. The results show that the vertical arrangement of the server motherboards can smoothly discharge the bubbles generated on the wall, while the horizontal arrangement will cause bubbles to gather under the motherboards, thus affecting heat dissipation. When the spacing between the motherboards is less than 50 mm, the bubbles generated by the motherboards will merge between the plates and affect the heat transfer, so the motherboard spacing should be set above 50 mm.